Integrated circuit apparatus, systems, and methods
High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are...
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Main Author | |
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Format | Patent |
Language | English |
Published |
09.09.2014
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Subjects | |
Online Access | Get full text |
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Summary: | High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed. |
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Bibliography: | Application Number: US201313953427 |