Spacer wafer for wafer-level camera and method of manufacturing same

A spacer wafer for a wafer-level camera and a method of manufacturing the spacer wafer include positioning a substrate in an additive manufacturing device and forming the spacer wafer over the substrate. The spacer wafer is formed by an additive manufacturing process.

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Bibliographic Details
Main Authors RAUKER GORAN, BARNES GEORGE
Format Patent
LanguageEnglish
Published 09.09.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL
PERFORMING OPERATIONS
PUNCHING METAL
ROLLING OF METAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A spacer wafer for a wafer-level camera and a method of manufacturing the spacer wafer include positioning a substrate in an additive manufacturing device and forming the spacer wafer over the substrate. The spacer wafer is formed by an additive manufacturing process.
Bibliography:Application Number: US201113296901