System and method for improved automated semiconductor wafer manufacturing

A method for aligning a photolithographic machine in an automated semiconductor manufacturing system is provided. The method may include identifying a maximum precision degree for a wafer and identifying a maximum overlay correction value. The method may simulate one or more algorithms to determine...

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Bibliographic Details
Main Authors CHIU CHE-YU, CHEN JIAN-HUNG, WU HSUEHN, HSIEH WEN-YAO, PENG ANWEI
Format Patent
LanguageEnglish
Published 02.09.2014
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CALCULATING
CINEMATOGRAPHY
COMPUTING
CONTROL OR REGULATING SYSTEMS IN GENERAL
CONTROLLING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTROGRAPHY
FUNCTIONAL ELEMENTS OF SUCH SYSTEMS
HOLOGRAPHY
MATERIALS THEREFOR
MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
REGULATING
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Summary:A method for aligning a photolithographic machine in an automated semiconductor manufacturing system is provided. The method may include identifying a maximum precision degree for a wafer and identifying a maximum overlay correction value. The method may simulate one or more algorithms to determine whether an algorithm aligns a leading lot within alignment specifications. The method may align a photolithography machine using an algorithm selected based on the simulations.
Bibliography:Application Number: US201313890975