Thermal dissipation in chip

A system for dissipating heat from a semiconductor board includes a first substrate including an opening formed therein, a second substrate attached to a surface of the first substrate, and a microchip positioned in the opening and bumped to the second substrate. The system further includes a heat s...

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Bibliographic Details
Main Authors ALHAYEK IYAD, BIANCO GERRY
Format Patent
LanguageEnglish
Published 15.07.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A system for dissipating heat from a semiconductor board includes a first substrate including an opening formed therein, a second substrate attached to a surface of the first substrate, and a microchip positioned in the opening and bumped to the second substrate. The system further includes a heat sink directly adhered to the microchip. A method of manufacturing a heat dissipating semiconductor board includes forming an opening in a first substrate and positioning a microchip in the opening. The method further includes directly adhering the microchip to a heat sink, bonding the microchip to a second substrate and boding a surface of the first substrate to the second substrate.
Bibliography:Application Number: US201213715152