Accurate integrated circuit performance prediction using on-board sensors

This invention places plural ring oscillators on a semiconductor chip during manufacture. The respective oscillation frequencies of these ring oscillators are measured. The semiconductor chip is assigned a grade dependent upon the measured frequencies. The ring oscillators are disposed proximate to...

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Bibliographic Details
Main Authors JOSHI MAYUR, HILL ANTHONY M, FLORES JOSE L
Format Patent
LanguageEnglish
Published 24.06.2014
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:This invention places plural ring oscillators on a semiconductor chip during manufacture. The respective oscillation frequencies of these ring oscillators are measured. The semiconductor chip is assigned a grade dependent upon the measured frequencies. The ring oscillators are disposed proximate to critical paths on the semiconductor chip and employ circuit types to model the critical path operation under as many the manufacturing variations as possible. A linearly fitted model of ring oscillator frequencies to critical path delays is constructed during characterization after manufacture.
Bibliography:Application Number: US20070839826