Aromatic vinyl ether based reverse-tone step and flash imprint lithography

• Main Authors: DIPIETRO RICHARD ANTHONY, ITO HIROSHI, HOULE FRANCES ANNE, HART MARK WHITNEY
• Format: Patent
• Language: English
• Published: 24.06.2014
• Subjects: APPARATUS SPECIALLY ADAPTED THEREFOR; CHEMISTRY; CINEMATOGRAPHY; COMPOSITIONS BASED THEREON; CORRECTION OF TYPOGRAPHICAL ERRORS; ELECTROGRAPHY; HOLOGRAPHY; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES; MATERIALS THEREFOR; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; METALLURGY; NANOTECHNOLOGY; ORGANIC MACROMOLECULAR COMPOUNDS; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; PRINTING; SELECTIVE PRINTING MECHANISMS; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; STAMPS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; TYPEWRITERS

A molding composition and a method of forming a pattern. The method includes forming on a substrate a molding layer of a molding composition of aromatic divinyl ethers; pressing the template into the molding layer, the template having a relief pattern, the molding layer filling voids in the relief pattern, the template not contacting the substrate; exposing the molding layer to actinic radiation, the actinic radiation converting the molding layer to a cured molding layer having thick and thin regions corresponding to the relief pattern; removing the template; filling the thin regions of the relief pattern with a backfill material; removing regions of the molding layer not protected by the backfill material to expose regions of the substrate; forming trenches in the exposed regions of the substrate; and removing any remaining molding layer and backfill material. A transfer layer may be used between the molding layer and the substrate.