Positive photosensitive resin composition, and display device and organic light emitting device using the same

Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D)...

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Bibliographic Details
Main Authors KIM SANG-SOO, LEE JONG-HWA, LEE JIN-YOUNG, NOH KUN-BAE, KIM DAE-YUN, YOON EUN-KYUNG, HWANG EUN-HA, KWON JI-YUN, KIM SANG-KYEON, HONG CHUNG-BEOM, LEE JUN-HO, KIM SANG-KYUN, CHO HYUN-YONG
Format Patent
LanguageEnglish
Published 27.05.2014
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same. The Chemical Formula 1 is the same as defined in the detailed description.
Bibliography:Application Number: US201213603491