Glass composition with low coefficient of thermal expansion, and glass fiber produced from same

The present disclosure relates to a glass composition having a low thermal expansion coefficient, specifically, a glass composition comprising about 55 to less than 64 weight percent of silicon oxide, about 15 to about 30 weight percent of aluminum oxide, about 5 to about 15 weight percent of magnes...

Full description

Saved in:
Bibliographic Details
Main Authors HUBLIKAR SUDHENDRA V, HAUSRATH ROBERT L, LONGOBARDO ANTHONY V
Format Patent
LanguageEnglish
Published 20.05.2014
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS
CHEMISTRY
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GLASS
JOINING GLASS TO GLASS OR OTHER MATERIALS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METALLURGY
MINERAL OR SLAG WOOL
PRINTED CIRCUITS
SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS
SURFACE TREATMENT OF GLASS
Online AccessGet full text

Cover

More Information
Summary:The present disclosure relates to a glass composition having a low thermal expansion coefficient, specifically, a glass composition comprising about 55 to less than 64 weight percent of silicon oxide, about 15 to about 30 weight percent of aluminum oxide, about 5 to about 15 weight percent of magnesium oxide, about 3 to about 10 weight percent boron oxide, about 0 to about 11 weight percent calcium oxide, and about 0 to about 2 weight percent of alkali oxide, the remainder being trace compounds of less than about 1 weight percent, is provided. Glass fibers and composite articles formed therefrom are also provided.
Bibliography:Application Number: US201213348073