High-K dielectric stack and method of fabricating same

A method for improving the reliability of a high-k dielectric layer or a high-k dielectric stack by forming an amorphous high-k dielectric layer over an insulating layer, doping the amorphous high-k dielectric layer with nitrogen atoms, and subsequently heating the resulting structure at a temperatu...

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Bibliographic Details
Main Authors FENIGSTEIN AMOS, ROIZIN YAKOV, HEIMAN ALEXEY, LISIANSKY MICHAEL
Format Patent
LanguageEnglish
Published 13.05.2014
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Summary:A method for improving the reliability of a high-k dielectric layer or a high-k dielectric stack by forming an amorphous high-k dielectric layer over an insulating layer, doping the amorphous high-k dielectric layer with nitrogen atoms, and subsequently heating the resulting structure at a temperature greater than or equal to the crystallization temperature of the high-k dielectric material, thereby transforming the high-k dielectric material from an amorphous state to a crystalline state, and causing nitrogen atoms to diffuse into the insulating layer.
Bibliography:Application Number: US20080014073