Embedded bonding pad for image sensors
A semiconductor device includes a semiconductor substrate having a front surface and a back surface, elements formed on the substrate, interconnect metal layers formed over the front surface of the substrate, including a topmost interconnect metal layer, an inter-metal dielectric for insulating each...
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| Main Authors | , , , , , , |
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| Format | Patent |
| Language | English |
| Published |
29.04.2014
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A semiconductor device includes a semiconductor substrate having a front surface and a back surface, elements formed on the substrate, interconnect metal layers formed over the front surface of the substrate, including a topmost interconnect metal layer, an inter-metal dielectric for insulating each of the plurality of interconnect metal layers, and a bonding pad disposed within the inter-metal dielectric, the bonding pad in contact with one of the interconnect metal layers other than the topmost interconnect metal layer. |
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| AbstractList | A semiconductor device includes a semiconductor substrate having a front surface and a back surface, elements formed on the substrate, interconnect metal layers formed over the front surface of the substrate, including a topmost interconnect metal layer, an inter-metal dielectric for insulating each of the plurality of interconnect metal layers, and a bonding pad disposed within the inter-metal dielectric, the bonding pad in contact with one of the interconnect metal layers other than the topmost interconnect metal layer. |
| Author | HSIEH YUANIH YU CHUNG-YI LIU SHIHANG HSU TZU-HSUAN FU SHIHI TSAI CHIA-SHIUNG SHIAU GWO-YUH |
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| RelatedCompanies | YU CHUNG-YI HSU TZU-HSUAN FU SHIH-CHI TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD TSAI CHIA-SHIUNG LIU SHIH-CHANG HSIEH YUAN-CHIH SHIAU GWO-YUH |
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| Snippet | A semiconductor device includes a semiconductor substrate having a front surface and a back surface, elements formed on the substrate, interconnect metal... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Embedded bonding pad for image sensors |
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