Self-aligned multiple gate transistor formed on a bulk substrate

Three-dimensional transistors in a bulk configuration may be formed on the basis of gate openings or gate trenches provided in a mask material. Hence, self-aligned semiconductor fins may be efficiently patterned in the underlying active region in a portion defined by the gate opening, while other ga...

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Bibliographic Details
Main Authors GROSCHOPF JOHANNES, SCHEIPER THILO, WEI ANDY, SCHROEDER VIVIEN, WERNER THOMAS
Format Patent
LanguageEnglish
Published 25.03.2014
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Summary:Three-dimensional transistors in a bulk configuration may be formed on the basis of gate openings or gate trenches provided in a mask material. Hence, self-aligned semiconductor fins may be efficiently patterned in the underlying active region in a portion defined by the gate opening, while other gate openings may be efficiently masked, in which planar transistors are to be provided. After patterning the semiconductor fins and adjusting the effective height thereof, the further processing may be continued on the basis of process techniques that may be commonly applied to the planar transistors and the three-dimensional transistors.
Bibliography:Application Number: US201113017558