Stacked nanowire field effect transistor

A method for fabricating a nanowire field effect transistor device includes depositing a first sacrificial layer on a substrate, depositing a first layer of a semiconductor material on the first sacrificial layer, depositing a second sacrificial layer on the first layer of semiconductor material, de...

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Bibliographic Details
Main Authors YAMASHITA TENKO, BASKER VEERARAGHAVAN S, YEH CHUNN
Format Patent
LanguageEnglish
Published 25.03.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES
NANOTECHNOLOGY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES
TRANSPORTING
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Summary:A method for fabricating a nanowire field effect transistor device includes depositing a first sacrificial layer on a substrate, depositing a first layer of a semiconductor material on the first sacrificial layer, depositing a second sacrificial layer on the first layer of semiconductor material, depositing a second layer of the semiconductor material on the second sacrificial layer, pattering and removing portions of the first sacrificial layer, the first semiconductor layer, the second sacrificial layer, and the second semiconductor layer, patterning a dummy gate stack, removing the dummy gate stack, removing portions of the sacrificial layer to define a first nanowire including a portion of the first semiconductor layer and a second nanowire including a portion of the second semiconductor layer, and forming gate stacks about the first nanowire and the second nanowire.
Bibliography:Application Number: US201213628726