Thermal control arrangement for a data processing system

Exemplary embodiments of methods and apparatuses to provide a cooling arrangement for a system are described. The system includes a component coupled to a heat sink. A signal associated with a temperature control of the component is asserted. A target temperature of the heat sink is adjusted based o...

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Bibliographic Details
Main Authors COX KEITH A, CONROY DAVID G, CULBERT MICHAEL
Format Patent
LanguageEnglish
Published 04.03.2014
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
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Summary:Exemplary embodiments of methods and apparatuses to provide a cooling arrangement for a system are described. The system includes a component coupled to a heat sink. A signal associated with a temperature control of the component is asserted. A target temperature of the heat sink is adjusted based on the signal. In one embodiment, a temperature control loop of the heat sink is operated. The temperature of the heat sink may be monitored using one or more sensors placed on the heat sink. An operation of the component, a cooling unit coupled to the heat sink, or both, may be adjusted based on a relationship between the temperature of the heat sink and an adjusted target temperature. Adjusting the target temperature of the heat sink based on the asserted signal increases efficiency of the system while decreasing cooling.
Bibliography:Application Number: US20060327685