Ball-limiting-metallurgy layers in solder ball structures

A structure. The structure includes: a first dielectric layer which includes a top dielectric surface; an electrically conductive line on the first dielectric layer; a second dielectric layer on the first dielectric layer and the electrically conductive line; a ball-limiting-metallurgy (BLM) region...

Full description

Saved in:
Bibliographic Details
Main Authors SULLIVAN TIMOTHY DOOLING, DAUBENSPECK TIMOTHY HARRISON, ARVIN CHARLES L, SAUTER WOLFGANG
Format Patent
LanguageEnglish
Published 26.11.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A structure. The structure includes: a first dielectric layer which includes a top dielectric surface; an electrically conductive line on the first dielectric layer; a second dielectric layer on the first dielectric layer and the electrically conductive line; a ball-limiting-metallurgy (BLM) region on the second dielectric layer and the electrically conductive line such that the BLM region is electrically connected to the electrically conductive line; and a solder ball on the BLM region. The BLM region has a characteristic that a length of the longest straight line segment which is parallel to the top dielectric surface and is entirely in the BLM region does not exceed a pre-specified maximum value, wherein the pre-specified maximum value is at most one-half of a maximum horizontal dimension of the BLM region measured in a horizontal direction parallel to the top dielectric surface.
Bibliography:Application Number: US201213615826