Method for dismantling device comprising at least one article embedded at least partially in resin
A method for dismantling a device including at least one article at least partially embedded in a resin, the article including a body and a housing at least partially surrounding the body, the housing being at least partially in contact with the resin, wherein the method includes extracting the body...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
13.08.2013
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Subjects | |
Online Access | Get full text |
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Summary: | A method for dismantling a device including at least one article at least partially embedded in a resin, the article including a body and a housing at least partially surrounding the body, the housing being at least partially in contact with the resin, wherein the method includes extracting the body from the housing, the housing remaining attached to the resin upon the extraction of the body. |
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Bibliography: | Application Number: US20080811469 |