Interconnect structures and methods of manufacturing of interconnect structures
Interconnect structures and methods of manufacturing the same are disclosed herein. The method includes forming a barrier layer within a structure and forming an alloy metal on the barrier layer. The method further includes forming a pure metal on the alloy metal, and reflowing the pure metal such t...
Saved in:
Main Authors | , |
---|---|
Format | Patent |
Language | English |
Published |
30.07.2013
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | Interconnect structures and methods of manufacturing the same are disclosed herein. The method includes forming a barrier layer within a structure and forming an alloy metal on the barrier layer. The method further includes forming a pure metal on the alloy metal, and reflowing the pure metal such that the pure metal migrates to a bottom of the structure, while the alloy metal prevents exposure of the barrier layer. The method further includes completely filling in the structure with additional metal. |
---|---|
Bibliography: | Application Number: US201213400610 |