Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface
Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
23.07.2013
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Subjects | |
Online Access | Get full text |
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Summary: | Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface. |
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Bibliography: | Application Number: US201013143222 |