Solution and process for increasing the solderability and corrosion resistance of a metal or metal alloy surface

Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.

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Bibliographic Details
Main Authors RUETHER ROBERT, BARTHELMES JUERGEN, KURTZ OLAF, BREITFELDER JANA
Format Patent
LanguageEnglish
Published 23.07.2013
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Summary:Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.
Bibliography:Application Number: US201013143222