Semiconductor device

A semiconductor device includes a main current external electrode for connecting a high-voltage main current electrode of a power semiconductor element to the outside, and a resin case into which the main current external electrode is press fitted. The main current external electrode has a press-fit...

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Main Author KOGA MASUO
Format Patent
LanguageEnglish
Published 18.06.2013
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Abstract A semiconductor device includes a main current external electrode for connecting a high-voltage main current electrode of a power semiconductor element to the outside, and a resin case into which the main current external electrode is press fitted. The main current external electrode has a press-fitted fixing portion and a claw fixing portion for fixation to the resin case. The claw fixing portion includes a projection passing through a through hole defined in the resin case, and having a bendable claw portion at its tip end.
AbstractList A semiconductor device includes a main current external electrode for connecting a high-voltage main current electrode of a power semiconductor element to the outside, and a resin case into which the main current external electrode is press fitted. The main current external electrode has a press-fitted fixing portion and a claw fixing portion for fixation to the resin case. The claw fixing portion includes a projection passing through a through hole defined in the resin case, and having a bendable claw portion at its tip end.
Author KOGA MASUO
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MITSUBISHI ELECTRIC CORPORATION
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Snippet A semiconductor device includes a main current external electrode for connecting a high-voltage main current electrode of a power semiconductor element to the...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Semiconductor device
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