Semiconductor device
A semiconductor device includes a main current external electrode for connecting a high-voltage main current electrode of a power semiconductor element to the outside, and a resin case into which the main current external electrode is press fitted. The main current external electrode has a press-fit...
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Main Author | |
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Format | Patent |
Language | English |
Published |
18.06.2013
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Subjects | |
Online Access | Get full text |
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Abstract | A semiconductor device includes a main current external electrode for connecting a high-voltage main current electrode of a power semiconductor element to the outside, and a resin case into which the main current external electrode is press fitted. The main current external electrode has a press-fitted fixing portion and a claw fixing portion for fixation to the resin case. The claw fixing portion includes a projection passing through a through hole defined in the resin case, and having a bendable claw portion at its tip end. |
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AbstractList | A semiconductor device includes a main current external electrode for connecting a high-voltage main current electrode of a power semiconductor element to the outside, and a resin case into which the main current external electrode is press fitted. The main current external electrode has a press-fitted fixing portion and a claw fixing portion for fixation to the resin case. The claw fixing portion includes a projection passing through a through hole defined in the resin case, and having a bendable claw portion at its tip end. |
Author | KOGA MASUO |
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Notes | Application Number: US201113187711 |
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PublicationYear | 2013 |
RelatedCompanies | KOGA MASUO MITSUBISHI ELECTRIC CORPORATION |
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Snippet | A semiconductor device includes a main current external electrode for connecting a high-voltage main current electrode of a power semiconductor element to the... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | Semiconductor device |
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