Semiconductor device

A semiconductor device includes a main current external electrode for connecting a high-voltage main current electrode of a power semiconductor element to the outside, and a resin case into which the main current external electrode is press fitted. The main current external electrode has a press-fit...

Full description

Saved in:
Bibliographic Details
Main Author KOGA MASUO
Format Patent
LanguageEnglish
Published 18.06.2013
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A semiconductor device includes a main current external electrode for connecting a high-voltage main current electrode of a power semiconductor element to the outside, and a resin case into which the main current external electrode is press fitted. The main current external electrode has a press-fitted fixing portion and a claw fixing portion for fixation to the resin case. The claw fixing portion includes a projection passing through a through hole defined in the resin case, and having a bendable claw portion at its tip end.
Bibliography:Application Number: US201113187711