Post-CMP wafer cleaning apparatus

A post-CMP wafer cleaning apparatus includes a chamber; a plurality of rollers adapted to hold and rotate a wafer within the chamber; at least one brush adapted to scrub a surface of the wafer to be cleaned; and a liquid spraying device adapted to spray a liquid on the wafer, the liquid spraying dev...

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Bibliographic Details
Main Authors LIU LIUNG, CHEN YI-NAN, LIU HSIEN-WEN
Format Patent
LanguageEnglish
Published 11.06.2013
Subjects
CLEANING
CLEANING IN GENERAL
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
TRANSPORTING
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Summary:A post-CMP wafer cleaning apparatus includes a chamber; a plurality of rollers adapted to hold and rotate a wafer within the chamber; at least one brush adapted to scrub a surface of the wafer to be cleaned; and a liquid spraying device adapted to spray a liquid on the wafer, the liquid spraying device comprising two spray bars jointed together via a joint member.
Bibliography:Application Number: US201113104964