Bump-on-trace structures with wide and narrow portions
A device includes a package component, and a metal trace on a surface of the package component. A first and a second dielectric mask cover a top surface and sidewalls of the metal trace, wherein a landing portion of the metal trace is located between the first and the second dielectric masks. The la...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
14.05.2013
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Subjects | |
Online Access | Get full text |
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Summary: | A device includes a package component, and a metal trace on a surface of the package component. A first and a second dielectric mask cover a top surface and sidewalls of the metal trace, wherein a landing portion of the metal trace is located between the first and the second dielectric masks. The landing portion includes a first portion having a first width, and a second portion connected to an end of the first portion. The second portion has a second width greater than the first width, wherein the first and the second widths are measured in a direction perpendicular to a lengthwise direction of the metal trace. |
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Bibliography: | Application Number: US201113172470 |