Substrate processing apparatus

A substrate processing apparatus having a polishing unit for polishing a periphery of a substrate. The substrate processing apparatus includes: a polishing unit configured to polish a periphery of a substrate; an imaging module configured to take an image of the periphery of the substrate polished b...

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Bibliographic Details
Main Authors KUSA HIROAKI, KIMBA TOSHIFUMI
Format Patent
LanguageEnglish
Published 09.04.2013
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PERFORMING OPERATIONS
PHYSICS
POLISHING
TESTING
TRANSPORTING
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Summary:A substrate processing apparatus having a polishing unit for polishing a periphery of a substrate. The substrate processing apparatus includes: a polishing unit configured to polish a periphery of a substrate; an imaging module configured to take an image of the periphery of the substrate polished by the polishing unit; and an image processing section configured to inspect a polished state of the substrate based on the image taken by the imaging module. The imaging module is configured to take the image of the periphery of the substrate when the polishing unit is not polishing the periphery of the substrate.
Bibliography:Application Number: US20090458814