Article including thermal interface element and method of preparation

An article and method of forming the article is disclosed. The article includes a heat source, a heat-sink, and a thermal interface element having a plurality of freestanding nanosprings, a top layer, and a bottom layer. The nanosprings, top layer, and the bottom layers of the article include at lea...

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Main Authors EASTMAN CHRISTOPHER MICHAEL, WEAVER, JR. STANTON EARL, TAO DENG, ZHONG DALONG, SHADDOCK DAVID MULFORD, DUROCHER KEVIN MATTHEW, DE BOCK HENDRIK PIETER JACOBUS
Format Patent
LanguageEnglish
Published 26.03.2013
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:An article and method of forming the article is disclosed. The article includes a heat source, a heat-sink, and a thermal interface element having a plurality of freestanding nanosprings, a top layer, and a bottom layer. The nanosprings, top layer, and the bottom layers of the article include at least one inorganic material. The article can be prepared using a number of methods including the methods such as GLAD and electrochemical deposition.
Bibliography:Application Number: US20100826337