Device and method for stopping an etching process
A method for etching a layer assembly, the layer assembly including an intermediate layer sandwiched between an etch layer and a stop layer, the method including a step of etching the etch layer using a first etchant and a step of etching the intermediate layer using a second etchant. The first etch...
Saved in:
Main Authors | , , , , |
---|---|
Format | Patent |
Language | English |
Published |
26.03.2013
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A method for etching a layer assembly, the layer assembly including an intermediate layer sandwiched between an etch layer and a stop layer, the method including a step of etching the etch layer using a first etchant and a step of etching the intermediate layer using a second etchant. The first etchant includes a first etch selectivity of at least 5:1 with respect to the etch layer and the intermediate layer. The second etchant includes a second etch selectivity of at least 5:1 with respect to the intermediate layer and the stop layer. The first etchant being different from the second etchant. |
---|---|
Bibliography: | Application Number: US20070937681 |