Terminal fitting

It is aimed not to increase contact resistance between a wire and a wire crimping portion even upon being subjected to a thermal cycle. A gold plating layer is formed on a base metal (20) via a nickel plating layer (21) in a terminal contact portion (11) to be held in contact with a mating terminal....

Full description

Saved in:
Bibliographic Details
Main Authors OKAMOTO MICHIAKI, NAKATA TAKEHIRO, INOUE TAKUYA
Format Patent
LanguageEnglish
Published 26.03.2013
Subjects
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
Online AccessGet full text

Cover

More Information
Summary:It is aimed not to increase contact resistance between a wire and a wire crimping portion even upon being subjected to a thermal cycle. A gold plating layer is formed on a base metal (20) via a nickel plating layer (21) in a terminal contact portion (11) to be held in contact with a mating terminal. A tin plating layer (23) is formed on the base metal (20) without via the nickel plating layer (21) in a wire crimping portion (12) to be crimped and connected to a core (15) of an insulated wire (14).
Bibliography:Application Number: US200913139077