Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

• Main Authors: KIM TAEEUN, CHO TAEJE, LEE CHIYOUNG, LEE HYUEKJAE, KWON WOONSEONG, KWON YONGHWAN, KIM JUNG-HWAN
• Format: Patent
• Language: English
• Published: 19.03.2013
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Microelectronic devices include a conductive via that extends into a substrate face and that also protrudes beyond the substrate face to define a conductive via end surface and a conductive via sidewall that extends from the end surface towards the substrate face. A conductive cap is provided on the end surface, the conductive cap including a conductive cap body that extends across the end surface and a flange that extends from the conductive cap body along the conductive via sidewall towards the substrate face. Related fabrication methods are also described.