Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

Microelectronic devices include a conductive via that extends into a substrate face and that also protrudes beyond the substrate face to define a conductive via end surface and a conductive via sidewall that extends from the end surface towards the substrate face. A conductive cap is provided on the...

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Bibliographic Details
Main Authors KIM TAEEUN, CHO TAEJE, LEE CHIYOUNG, LEE HYUEKJAE, KWON WOONSEONG, KWON YONGHWAN, KIM JUNG-HWAN
Format Patent
LanguageEnglish
Published 19.03.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Microelectronic devices include a conductive via that extends into a substrate face and that also protrudes beyond the substrate face to define a conductive via end surface and a conductive via sidewall that extends from the end surface towards the substrate face. A conductive cap is provided on the end surface, the conductive cap including a conductive cap body that extends across the end surface and a flange that extends from the conductive cap body along the conductive via sidewall towards the substrate face. Related fabrication methods are also described.
Bibliography:Application Number: US20100951140