Semiconductor storage device
According to one embodiment, a semiconductor device includes a memory chip and a controller chip. A circuit board includes a first surface on which an array of external connection terminals are provided and an second surface on which the memory and controller chips are provided. An array of connecti...
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Main Author | |
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Format | Patent |
Language | English |
Published |
19.02.2013
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Subjects | |
Online Access | Get full text |
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Summary: | According to one embodiment, a semiconductor device includes a memory chip and a controller chip. A circuit board includes a first surface on which an array of external connection terminals are provided and an second surface on which the memory and controller chips are provided. An array of connection pads is provided on the second surface and outside the memory chip at an external connection terminal side. An array of resistor devices is provided on the second surface and along the array of connection pads at the opposite side of the memory chip. Plugs outside near-memory-chip ends of the external connection terminals penetrate the first and surfaces. A first wiring passes outside the array of resistor devices and the array of connection pads on the second surface, and connects one resistor device and one plug. A second wiring on the first surface connects one plug and one external connection terminal. |
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Bibliography: | Application Number: US20100887000 |