Electric via comprising lateral outgrowths

A via connecting the front surface of a substrate to its rear surface, this substrate including a porous region extending from at least a portion of the periphery of the via, the via including outgrowths extending in pores of the porous region.

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Bibliographic Details
Main Authors CADIX LIONEL, CHAABOUNI HAMED
Format Patent
LanguageEnglish
Published 08.01.2013
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A via connecting the front surface of a substrate to its rear surface, this substrate including a porous region extending from at least a portion of the periphery of the via, the via including outgrowths extending in pores of the porous region.
Bibliography:Application Number: US20100831438