Sealant for one drop fill process containing photo-curable resin and heat-curable resin

• Main Authors: HAMADA RIEKO, ITANO KAZUYUKI, FUKUNGA HIROYA, SHINANO HIROKATSU, OTSUKA TAKAHIRO
• Format: Patent
• Language: English
• Published: 25.12.2012
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BLASTING; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CYLINDERS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; DYES; ENGINEERING ELEMENTS AND UNITS; FREQUENCY-CHANGING; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; HEATING; LIGHTING; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; MECHANICAL ENGINEERING; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-LINEAR OPTICS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PHYSICS; PISTONS; POLISHES; SEALINGS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; THEIR PREPARATION OR CHEMICAL WORKING-UP; THERMAL INSULATION IN GENERAL; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; WEAPONS

A sealant for a one drop fill process of the invention contains the following components (1), (2), (3), and (4): (1) a curing agent composed of a reaction product produced by reacting an acid compound and a polyamine containing, within its molecule, at least one active hydrogen and at least two nitrogen atoms; (2) a heat-curable resin; (3) an acylphosphine-based photoinitiator; and (4) a photo-curable resin. A heat-curable resin containing a bisphenol A propylene oxide-modified epoxy resin is preferably used as the heat-curable resin (2), and a photo-curable resin containing a bisphenol A acrylate-modified resin is preferably used as the photo-curable resin (4).