Roll-to-roll atomic layer deposition method and system

• Main Author: PICHLER KARL
• Format: Patent
• Language: English
• Published: 06.11.2012
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

Atomic layer deposition in a roll-to-roll manufacturing environment is disclosed. At least a portion of a substrate from a first roll is disposed in a chamber. A first atomic layer deposition (ALD) half reaction is performed on the portion of the substrate while the portion is within the chamber. A subsequent ALD half reaction may be performed on the same portion of the substrate to form a layer of material. Multiple ALD sequences may be performed by passing the substrate through a sequence of ALD reaction chambers or by passing the substrate through one or more ALD reaction chambers in a continuous loop.