Drywall sealing tape

A drywall sealing tape which includes a substrate layer and a mesh layer made of mesh filament. The mesh layer is an array of filaments formed together which, when adjacent the substrate, create an inter-filament cavity for receiving and retaining joint compound between the substrate and the drywall...

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Bibliographic Details
Main Author BANTA MARK K
Format Patent
LanguageEnglish
Published 23.10.2012
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BUILDING
CEILINGS
CHEMISTRY
DYES
FIXED CONSTRUCTIONS
FLOORS
GENERAL BUILDING CONSTRUCTIONS
INSULATION OR OTHER PROTECTION OF BUILDINGS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
ROOFS
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
WALLS, e.g. PARTITIONS
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Summary:A drywall sealing tape which includes a substrate layer and a mesh layer made of mesh filament. The mesh layer is an array of filaments formed together which, when adjacent the substrate, create an inter-filament cavity for receiving and retaining joint compound between the substrate and the drywall panel. In use, the drywall sealing tape of the present invention may be coated with joint compound and applied to a drywall panel. The inter-filament cavities retain a volume of joint compound corresponding to the approximate thickness of the mesh filament. The joint compound retained within the cavities serves to bond the drywall sealing tape of the present invention to the drywall panels, and provides a seamless, crack-resistant surface.
Bibliography:Application Number: US20060464045