Method of manufacturing a semiconductor package and semiconductor package having an electrode pad with a small pitch

A board on which a wiring having an electrode pad is formed is prepared. A resist film is formed on the board in order to cover the wiring and then the resist film is left on the electrode pad through patterning. An inorganic insulating film is formed on the board in order to cover the wiring and th...

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Bibliographic Details
Main Authors ROKUGAWA AKIO, SHIMIZU NORIYOSHI
Format Patent
LanguageEnglish
Published 16.10.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A board on which a wiring having an electrode pad is formed is prepared. A resist film is formed on the board in order to cover the wiring and then the resist film is left on the electrode pad through patterning. An inorganic insulating film is formed on the board in order to cover the wiring and then the resist film is removed, thereby removing the inorganic insulating film provided on the resist film to leave the inorganic insulating film between the wirings. A solder resist layer is formed on the board in order to cover the wiring and then the electrode pad is exposed.
Bibliography:Application Number: US20100749117