System and method for calibrating a lithography model
The present invention provides a method for calibrating a computational model of a lithography process by calculating a demerit function using an intensity measurement at a location of a wafer; and calibrating the lithography model or a mask making model by determining values of parameters of the co...
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Format | Patent |
Language | English |
Published |
02.10.2012
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Abstract | The present invention provides a method for calibrating a computational model of a lithography process by calculating a demerit function using an intensity measurement at a location of a wafer; and calibrating the lithography model or a mask making model by determining values of parameters of the computational model using the calculated demerit function. The method may also use a second demerit function that is defined by the sum of squares of differences between a simulated and measured critical dimensions of a feature on the wafer. |
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AbstractList | The present invention provides a method for calibrating a computational model of a lithography process by calculating a demerit function using an intensity measurement at a location of a wafer; and calibrating the lithography model or a mask making model by determining values of parameters of the computational model using the calculated demerit function. The method may also use a second demerit function that is defined by the sum of squares of differences between a simulated and measured critical dimensions of a feature on the wafer. |
Author | CHUYESHOV KOSTYANTYN SEZGINER ABDURRAHMAN HUANG HSU-TING CHOW TATUNG CARRERO JESUS ORSELY PERCIN GOKHAN |
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RelatedCompanies | CHUYESHOV KOSTYANTYN SEZGINER ABDURRAHMAN HUANG HSU-TING CHOW TATUNG CADENCE DESIGN SYSTEMS, INC CARRERO JESUS ORSELY PERCIN GOKHAN |
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Snippet | The present invention provides a method for calibrating a computational model of a lithography process by calculating a demerit function using an intensity... |
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Title | System and method for calibrating a lithography model |
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