Apparatus and method for electroplating a substrate in a continuous way

An apparatus and a method deposits a metal coating on an electrically conductive substrate in a continuous way. The apparatus includes at least one plating vessel for receiving an electrolyte solution and at least one plating unit. The plating unit includes a first zone comprising at least one first...

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Bibliographic Details
Main Authors FRANCOIS ROGER, HOFMAN LUC
Format Patent
LanguageEnglish
Published 21.08.2012
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:An apparatus and a method deposits a metal coating on an electrically conductive substrate in a continuous way. The apparatus includes at least one plating vessel for receiving an electrolyte solution and at least one plating unit. The plating unit includes a first zone comprising at least one first electrode (anode) connected to a positive pole of a power supply; a second zone comprising at least one second electrode (cathode) connected to a negative pole of the power supply; and an intermediate zone between the first zone and the second zone. The intermediate zone separates the first zone from the second zone by a predetermined distance larger than zero. The substrate functions as a cathode having a current density Jc when the substrate is facing the first electrode, and as an anode having a current density Ja when the substrate is facing the second electrode.
Bibliography:Application Number: US20070305348