Semiconductor device having a multilayer interconnection structure that includes an etching stopper film
A semiconductor device includes a lower layer wiring made of a conductive material; an etching stopper film laminated on the lower layer wiring and having a laminated structure including an SiCO layer and an SiCN layer; an interlayer insulating film laminated on the etching stopper film; an intermed...
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Main Author | |
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Format | Patent |
Language | English |
Published |
24.07.2012
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Subjects | |
Online Access | Get full text |
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