Semiconductor device having a multilayer interconnection structure that includes an etching stopper film

A semiconductor device includes a lower layer wiring made of a conductive material; an etching stopper film laminated on the lower layer wiring and having a laminated structure including an SiCO layer and an SiCN layer; an interlayer insulating film laminated on the etching stopper film; an intermed...

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Bibliographic Details
Main Author KAGEYAMA SATOSHI
Format Patent
LanguageEnglish
Published 24.07.2012
Subjects
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