Low thermal mass semiconductor wafer plate
A support for a semiconductor wafer includes a plate having a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contami...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
17.07.2012
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Subjects | |
Online Access | Get full text |
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Summary: | A support for a semiconductor wafer includes a plate having a support surface for supporting the wafer and a recessed surface spaced from the support surface and spaced from the wafer. A plurality of holes extends from the recessed surface, and the support surface is free of holes to inhibit contamination of the wafer. |
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Bibliography: | Application Number: US201113232676 |