Analyzing apparatus, analyzing method, and computer-readable recording medium storing an analyzing program

• Main Author: SAKAI HIDEHISA
• Format: Patent
• Language: English
• Published: 19.06.2012
• Subjects: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL; METERING BY VOLUME; PHYSICS; TESTING

An analyzing method includes acquiring displacements with respect to loads applied of the test piece measured by the three-point bending test; calculating a first approximate expression of a relation of the displacements with respect to the loads applied in a first area where the relation is linear so as to determine an elasticity modulus of the test piece; extracting boundary value of a relation of strains caused by the displacements with respect to the loads so as to determine a yield stress value of the test piece; and calculating a second approximate expression of a relation of stress caused by the loads with respect to the strains caused by the displacements in a second area beyond the yield stress value on the basis of the yield stress value, the elasticity modulus, and the measurements in the second area.