Light emitting diode package

A light emitting diode (LED) package including: an LED chip; a first lead frame having a heat transfer unit with a top where a groove for stably mounting the LED chip is formed; a second lead frame disposed separately from the first lead frame; a package body having a concave portion encapsulating a...

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Bibliographic Details
Main Authors KIM KYUNG TAE, MIN BONG GIRL, PARK JE MYUNG
Format Patent
LanguageEnglish
Published 19.06.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A light emitting diode (LED) package including: an LED chip; a first lead frame having a heat transfer unit with a top where a groove for stably mounting the LED chip is formed; a second lead frame disposed separately from the first lead frame; a package body having a concave portion encapsulating a portion of the heat transfer unit and the second lead frame but exposing a portion of the top of the heat transfer unit and a portion of the lead frame, and a ring-shaped portion extended in a ring shape along an inner wall of the groove of the heat transfer unit and forming an aperture in a center thereof; and a phosphor layer formed on the aperture of the ring-shaped portion and applied to the LED chip, wherein the LED chip is disposed in the inside of the aperture of the ring-shape portion.
Bibliography:Application Number: US20080071321