Method of manufacturing substrate and substrate, method of manufacturing liquid drop ejecting head and liquid drop ejecting head, and liquid drop ejecting device

• Main Authors: MURATA MICHIAKI, NAYVE REGAN
• Format: Patent
• Language: English
• Published: 15.05.2012
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CORRECTION OF TYPOGRAPHICAL ERRORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; LINING MACHINES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; PRINTING; SELECTIVE PRINTING MECHANISMS; STAMPS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; TYPEWRITERS

The present invention provides a method of manufacturing a substrate which forms a wiring pattern on a substrate having a plurality of through-holes. In the method, the wiring pattern is formed, after burying a filling material into the through-holes and planarizing a surface of the substrate. The filling material may be a conductive material, and a portion of the conductive material may be removed after the wiring pattern is formed. Removal of the portion of the conductive material may be carried out after a protective film, which protects the wiring pattern, is formed. The filling material may be a conductive material and a sacrificial material, and the sacrificial material may be removed after the wiring pattern is formed.