Integrated liquid to air conduction module

An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer...

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Bibliographic Details
Main Authors BREWER RICHARD, HOM JAMES, WERNER DOUGLAS E, MUNCH MARK, CONWAY BRUCE, ZHOU PENG, UPADHYA GIRISH, TSAO PAUL
Format Patent
LanguageEnglish
Published 17.04.2012
Subjects
BLASTING
CONTROLLING
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
HEAT EXCHANGE IN GENERAL
HEATING
LIGHTING
MECHANICAL ENGINEERING
PHYSICS
REGULATING
SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
WEAPONS
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Summary:An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.
Bibliography:Application Number: US20070731484