Circuit connection structure, method for producing the same and semiconductor substrate for circuit connection structure

• Main Authors: ITABASHI TOSHIAKI, KANEYA YUICHI, TANAKA TOSHIAKI
• Format: Patent
• Language: English
• Published: 03.04.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A circuit connection structure that exhibits excellent adhesiveness between a heat resistant resin film and a circuit adhesive member, even under high temperature and high humidity, is provided by introducing a chemically stable functional group into the heat resistant resin film by additional surface treatment to improve adhesiveness. In a circuit connection structure, a semiconductor substrate and a circuit member are adhered by a circuit adhesive member sandwiched therewith. First circuit electrode on the semiconductor substrate and second circuit electrode on the circuit member are connected electrically by conductive particles in the circuit adhesive member. A surface modification is given to the semiconductor substrate by plasma treatment using gas containing nitrogen, ammonia and the like. Therefore, the heat resistant resin film on the semiconductor substrate and the circuit adhesive member are firmly adhered for a long period of time even under high temperature and high humidity.