Housing for electronic device, mold for making the housing, and method for making the housing

A housing for an electronic device is disclosed, the housing comprises a base layer and a transparent film layer overlapped in the base layer, the film layer includes an inner surface abutting the base layer and an outer surface having ridges protruding thereform. The housing is formed by injection...

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Bibliographic Details
Main Authors WEN SAN-YUAN, YAN QI-QUAN, TSAO BEN-DING, HE YUE-JUN, XIONG WEN-LIN, DUAN MAN-XIANG
Format Patent
LanguageEnglish
Published 27.03.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
TRANSPORTING
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Summary:A housing for an electronic device is disclosed, the housing comprises a base layer and a transparent film layer overlapped in the base layer, the film layer includes an inner surface abutting the base layer and an outer surface having ridges protruding thereform. The housing is formed by injection molding a molten plastic material over the transparent film layer, the ridges are formed on the transparent film layer by the molten plastic pressing the transparent film layer in injection molding. It is also disclosed a mold for making the housing and a method to make the housing.
Bibliography:Application Number: US20090634800