Physical vapor deposition system
A physical vapor deposition system for making microparticles generated by using a non-transfer type plasma torch not generating an outgas even in an ultra-high vacuum environment accelerate by a supersonic gas flow and depositing microparticles on a substrate to form a coating film is provided. Prov...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
20.03.2012
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Subjects | |
Online Access | Get full text |
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Summary: | A physical vapor deposition system for making microparticles generated by using a non-transfer type plasma torch not generating an outgas even in an ultra-high vacuum environment accelerate by a supersonic gas flow and depositing microparticles on a substrate to form a coating film is provided. Provision is made of an evaporation chamber (10, 20) having a plasma torch (16, 26) and an evaporation source (15, 25) inside it and a film formation chamber 30 having a supersonic nozzle 35 and a substrate for film formation 33. Each plasma torch has a substantially cylindrical electrically conductive anode 40, a polymer-based or non-polymer-based insulation pipe 50 inserted to the inner side of that and generating less outgas than a phenol resin, and a rod shaped cathode 60 inserted to the inner side of an insulation pipe 50. Microparticles are generated from an evaporation source (15, 25) by a plasma obtained by applying voltages to the anode 40 and the cathode 60, ejected from a supersonic nozzle 35, made to ride on a supersonic gas flow, and deposited by physical vapor deposition onto a substrate for film formation 33. |
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Bibliography: | Application Number: US20050577305 |