Adhesive composition suitable to be applied by screen printing

• Main Authors: KANAMARU TATSUYA, HONDA TSUYOSHI
• Format: Patent
• Language: English
• Published: 07.02.2012
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; ARTIFICIAL STONE; BASIC ELECTRIC ELEMENTS; CEMENTS; CERAMICS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS; CONCRETE; CONVEYING; DEVICES OR ARRANGEMENTS RELATED TO TYRES; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; LABELLING OR TAGGING MACHINES, APPARATUS, OR PROCESSES; LIME, MAGNESIA; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PACKING; PAINTS; PERFORMING OPERATIONS; POLISHES; REFRACTORIES; REPAIRING, OR CONNECTING VALVES TO, INFLATABLE ELASTIC BODIESIN GENERAL; SEMICONDUCTOR DEVICES; SLAG; STORING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; TREATMENT OF NATURAL STONE; TYRE CHANGING OR REPAIRING; TYRE INFLATION; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; VEHICLE TYRES; VEHICLES IN GENERAL

An adhesive composition comprising (A) an epoxy resin, (B) a curing agent, (C) a curing promoter, (D) an inorganic filler, (E) particles of a thermoplastic resin which is solid at 25° C., and (F) silicone powder having a particle size at cumulative 50% (d50), measured by a laser light diffraction method, of from 1 to 50 μm. The composition is particularly suitable to be applied by screen printing on a substrate or a silicon wafer.