Electronic circuit board manufacturing apparatus and electronic circuit board

In an electron-emitting device manufacturing apparatus for forming a surface conduction electron-emitting element by a conductive thin film, a discharge head of a piezo-jet type using a piezoelectric element has a diameter being equal to or less than 25μm and jets a solution that includes metal micr...

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Bibliographic Details
Main Author SEKIYA TAKURO
Format Patent
LanguageEnglish
Published 15.11.2011
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Summary:In an electron-emitting device manufacturing apparatus for forming a surface conduction electron-emitting element by a conductive thin film, a discharge head of a piezo-jet type using a piezoelectric element has a diameter being equal to or less than 25μm and jets a solution that includes metal micro-particle material for forming the conductive thin film, on the area between the electrodes, which are formed on a substrate of the electron-emitting device, as a droplet. A volatile component in a solution dot pattern is vaporized after the droplet is jetted on the substrate so that a solid content is remained on the substrate. The solution having micro-particle dispersed in liquid satisfies a relationship of 0.0002 Dp/Do 0.01 where Dp denotes a diameter of the metal micro-particle and Do denotes a diameter of the discharge opening.
Bibliography:Application Number: US20090362263