Electronic components on trenched substrates and method of forming same

A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on...

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Bibliographic Details
Main Authors KHANNA VIJAYESHWAR D, SRI-JAYANTHA SRI M, QUESTAD DAVID, SHARMA ARUN, MUNEY JENNIFER V, VALDEVIT LORENZO
Format Patent
LanguageEnglish
Published 08.11.2011
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
Bibliography:Application Number: US20080030260