Multi lead frame power package
According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
08.11.2011
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Subjects | |
Online Access | Get full text |
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