Multi lead frame power package
According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
08.11.2011
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy. |
---|---|
Bibliography: | Application Number: US20090573196 |