Heat spreader package and method

A heat spreader package includes a substrate having a first surface, first traces on the first surface of the substrate, and an electronic component having an inactive surface mounted to the first surface of the substrate. The electronic component further includes an active surface having bond pads....

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Bibliographic Details
Main Authors KANUPARTHI SASANKA LAXMI NARASIMHA, ARCEDERA ADRIAN
Format Patent
LanguageEnglish
Published 16.08.2011
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A heat spreader package includes a substrate having a first surface, first traces on the first surface of the substrate, and an electronic component having an inactive surface mounted to the first surface of the substrate. The electronic component further includes an active surface having bond pads. Bond wires electrically connect the bond pads to the first traces. An inverted pyramid heat spreader includes a first heatsink, a first heatsink adhesive directly connecting the first heatsink to the active surface of the electronic component inward of the bond pads, a second heatsink having an absence of active circuitry, and a second heatsink adhesive directly connecting a first surface of the second heatsink to the first heatsink. The second heatsink adhesive is a dielectric directly between the bond wires and the second heatsink that prevents inadvertent shorting between the bond wires and the second heatsink.
Bibliography:Application Number: US20100702505